IEC 61191-1-2018 pdf download.Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies.
This part of IEC 61 1 91 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61 1 91 also includes recommendations for good manufacturing processes.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 601 94, Printed board design, manufacture and assembly – Terms and definitions
IEC 60721 -3-1 , Classification of environmental conditions – Part 3: Classification of groups of environmental parameters and their severities – Storage
IEC 61 1 89-1 , Test methods for electrical materials, interconnection structures and assemblies – Part 1: General test methods and methodology
IEC 61 1 89-3, Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
IEC 61 1 90-1 -1 , Attachment materials for electronic assembly – Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61 1 90-1 -3, Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61 1 91 -2, Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
IEC 61 1 91 -3, Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
IEC 61 1 91 -4, Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies
IEC 61 249-8-8, Materials for interconnection structures – Part 8: Sectional specification set for non-conductive films and coatings – Section 8: Temporary polymer coatings
IEC 61 340-5-1 , Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements
IEC/TR 61 340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide
IEC 61 760-2, Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
ISO 9001 :2008, Quality management systems – Requirements IPC-A-61 0, Acceptability of Electronic Assemblies
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 601 94 and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 bow
deviation from flatness of a board characterized by a roughly cylindrical or spherical curvature so that, if the product is rectangular, its four corners are in the same plane
3.2 manufacturer
assembler individual or company responsible for the procurement of materials and components, as well as all assembly process and verification operations necessary to ensure full compliance of assemblies with this document
3.3 objective evidence
documentation agreed to between the user and the manufacturer
Note 1 to entry: The documentation can be in the form of a hard copy, computer data, computer algorithms, video or other media.
3.4 process indicator
detectable anomaly, other than a defect, that is reflective of material, equipment, personnel, process and/or workmanship variation.IEC 61191-1 pdf download.