BS IEC 62047-31-2019 pdf download

BS IEC 62047-31-2019 pdf download.Semiconductor devices – Micro- electromechanical devices Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials. 5 Testing method and test apparatus 5.1 Test principle The test is performed by applying a pure bending moment to a test piece with a layered...